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    Mask Cut Repair | High-Precision Laser System for Photomasks

    Mask Cut Repair with SEMISHARE L14 Series, delivering precise laser cutting and defect repair for photomasks in semiconductor manufacturing.

    Mask Cut Repair: Revolutionizing Photomask Defect Correction with Precision and Efficiency

    In the semiconductor manufacturing industry, photomasks play a critical role in transferring intricate circuit patterns onto silicon wafers. However, defects such as particles, scratches, or material inconsistencies can occur during the use of photomasks, leading to yield losses and increased production costs. This is where Mask Cut Repair technology comes into play. The L14 Series Mask Cut Repair System by SEMISHARE is a state-of-the-art solution designed to address these challenges with unparalleled precision and efficiency. With the L14 Series, the industry is experiencing a significant shift towards more reliable, cost-effective production.

    How Does Mask Cut Repair Achieve High-Precision Repairs?

    At the heart of the L14 Series Mask Cut Repair System is SEMISHARE's advanced machine vision system. This system enables the detection and analysis of photomask defects with exceptional accuracy, ensuring that even the smallest imperfections are identified and addressed.

    The machine vision system uses high-resolution imaging and intelligent algorithms to scan the photomask surface, pinpointing defects such as foreign particles, scratches, or material inconsistencies. Once a defect is detected, the system generates a precise repair plan, guiding the laser to remove or correct the defective area without damaging the surrounding regions. This level of precision is critical for maintaining the integrity of the photomask and ensuring high yields in semiconductor production.

    The Mask Cut Repair process leverages this advanced vision system to deliver nanometer-scale accuracy, making it an indispensable tool for modern semiconductor manufacturing. For example, in advanced nodes like 5nm and 3nm, even a minor defect can significantly impact yield. The L14 Series ensures that such defects are repaired with minimal deviation, preserving the photomask's functionality and extending its lifespan.

    Can Mask Cut Repair Handle Multiple Photomask Materials?

    One of the standout features of the L14 Series Mask Cut Repair System is its ability to handle a wide range of photomask materials. Whether the photomask is made of chromium, silicon, silicon nitride, quartz, or even advanced EUV (Extreme Ultraviolet) materials, the Mask Cut Repair technology can effectively address defects.

    For example, when repairing a chromium-on-quartz photomask, the system can precisely remove excess chromium or deposit new material to fill in defects, all while preserving the underlying quartz layer. This versatility ensures that the L14 Series can meet the diverse needs of semiconductor manufacturers, regardless of the photomask material used.

    The ability to repair multiple materials with high precision makes Mask Cut Repair a cost-effective solution, as it eliminates the need for multiple specialized repair systems. This adaptability is particularly valuable in a rapidly evolving industry where new materials and technologies are constantly being introduced.

    Why Is Mask Cut Repair a Non-Destructive Process?

    A key advantage of Mask Cut Repair technology is its non-destructive nature. Traditional repair methods often risk damaging the photomask or introducing new defects during the repair process. In contrast, the L14 Series uses a laser-based approach that minimizes collateral damage.

    The system's laser is finely tuned to target only the defective area, ensuring that the surrounding regions remain unaffected. This non-destructive approach not only preserves the photomask's structural integrity but also extends its lifespan, reducing the need for frequent replacements and lowering overall production costs.

    By combining precision and non-destructive techniques, Mask Cut Repair technology sets a new standard for photomask defect correction. For instance, in high-volume manufacturing environments, the ability to repair photomasks without causing additional damage is crucial for maintaining production efficiency and reducing downtime.

    How Does Mask Cut Repair Offer Customization for Specific Needs?

    Every semiconductor manufacturer has unique requirements, and the L14 Series Mask Cut Repair System is designed to accommodate these needs. The system offers a high degree of customization, allowing users to tailor the repair process to their specific photomask designs and defect types.

    For instance, manufacturers can adjust the laser parameters, such as energy levels and beam size, to optimize the repair process for different materials or defect sizes. Additionally, the system's software can be customized to integrate with existing production workflows, ensuring seamless operation and minimal downtime.

    This flexibility makes the L14 Series a versatile solution for a wide range of applications, from advanced EUV photomasks to traditional quartz-based masks. Whether a manufacturer is working on cutting-edge technologies or established processes, the Mask Cut Repair system can be adapted to meet their specific needs.

    How Does Mask Cut Repair Enhance Efficiency and Reduce Costs?

    In the highly competitive semiconductor industry, efficiency and cost-effectiveness are critical. The L14 Series Mask Cut Repair System is designed to maximize both. Its automated defect detection and repair capabilities significantly reduce the need for manual intervention, speeding up the repair process and minimizing human error.

    Moreover, the system's high precision and non-destructive approach reduce material waste and extend the lifespan of photomasks, leading to substantial cost savings over time. By improving repair accuracy and efficiency, Mask Cut Repair technology helps manufacturers achieve higher yields and lower production costs.

    For example, in a high-volume manufacturing facility, the ability to quickly and accurately repair photomasks can significantly reduce downtime and improve overall throughput. This not only enhances productivity but also ensures that manufacturers can meet tight production deadlines without compromising on quality.

    How Is Mask Cut Repair Future-Proofing Semiconductor Manufacturing?

    As semiconductor technology continues to advance, the demands on photomask quality and repair precision will only increase. The L14 Series Mask Cut Repair System is built to meet these future challenges. Its advanced laser technology, coupled with intelligent algorithms, ensures that it can handle even the most complex photomask defects at nodes as advanced as 5nm and 3nm.

    Furthermore, ongoing advancements in Mask Cut Repair technology, such as improved laser sources and enhanced machine learning algorithms, promise to further elevate its capabilities. This future-proof design ensures that the L14 Series will remain a vital tool for semiconductor manufacturers as they push the boundaries of innovation.

    For instance, as the industry moves toward even smaller technology nodes, the need for precise and reliable photomask repair solutions will only grow. The L14 Series is designed to meet these evolving demands, making it a long-term investment for manufacturers looking to stay ahead in the competitive semiconductor landscape.

    The L14 Series Mask Cut Repair System represents a significant leap forward in photomask defect correction. With its advanced machine vision system, versatility in handling multiple materials, non-destructive repair process, and high degree of customization, it offers a comprehensive solution for semiconductor manufacturers. By enhancing precision, efficiency, and cost-effectiveness, Mask Cut Repair technology is playing a pivotal role in the future of semiconductor manufacturing.

    As the industry continues to evolve, the demand for advanced Mask Cut Repair solutions like the L14 Series will only grow, making it an indispensable tool for achieving high yields and maintaining a competitive edge. Whether addressing current challenges or preparing for future advancements, the L14 Series is a testament to the power of innovation in driving the semiconductor industry forward.

    Product Overview Functional structure Specifications Download
    Mask Cut Repair L14

    Product Overview

    The L14 series mask laser cutting and repair equipment is mainly used to repair defects that occur during the use of photomasks. At the core of the device is SEMISHARE's advanced machine vision system, which provides a high-precision, cost-effective repair solution for high-value photomask defects that helps companies lower production and operational costs.

    Basic Information

    Product number L14 working environment Open Type
    electricity demand AC 220V ±5% 50Hz Control method Manual
    Product Size Customizable equipment weight Customizable

    Application direction

    Application scenarios that require precise cutting or removal of specific material layers.

    Technical characteristics

    Mask Cut Repair L14

    ●It can handle the repair of various materials including chromium, silicon, silicon nitride, quartz, EUV materials, foreign particles and stubborn unknown particles.
    ●It can precisely remove or repair defective areas without affecting other parts of the mask.
    ●It can provide customized products according to customer needs.

    Title

    Stage

    Size

    500mm*320mm

    X-Y Travel

    8*8 inches

    Sample Fixing Method

    natural placement

    Light Source

    backlight, upper light source

    Microscope Characteristics

    Travel

    mirror body fixed, Z-axis travel: 50mm

    CCD Pixel

    50W(analog)/200W(digital)/500W(digital)

    Eyepiece

    10X eyepiece

    Objective Lens

    5X, 10X, 20X, 50X (optional), 100X (optional)

    Objective Lens Turntable

    manual nose wheel

    Laser Characteristics

    Wavelength

    optional wavelength: 1064/532/355/266nm band

    Energy

    output power: 2.2mJ/pulse

    Micromachining Capability

    machinable materials: Cr/Al/ITO/Ni/TFT/RGB/Poly Silicon/Mo/SiN/mpurities in CF, etc.

    Processing Accuracy

    minimum process accuracy 1*1μm (when equipped with 100X lens)

    Cooling Method

    air-cooled laser/water-cooled laser


    Customer Service
    Request for quotation Request for quotation
    Contact number

    Contact number

    0755-2690 6952 turn 801/804/806/814

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