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    FA8-Inch Failure Analysis Probe Station

    Product Overview

    FA series probe bench is a kind of measuring equipment specially designed for failure analysis laboratory. It has optical characteristic, laser characteristic, stable equipment structure, excellent system performance, ergonomic design, convenient operation, support multi-function upgrade, and rich and complete product functions.

    Basic Information

    Product number FA8 working environment Open type
    electricity demand 220VC,50~60Hz Control method Manual Probe Station
    Product Size 960mm long *850mm wide *1500mm high equipment weight About 260 kg

    Application direction

    Chip Failure Analysis AT room temperature and high and low temperature rf device Failure analysis MATERIAL/device IV/CV characteristic test and Failure analysis Chip internal circuit/electrode /PAD test IC/ panel internal circuit modification/layer removal.

    Technical characteristics

    Product Feature

    ●Large handle drive, no clearance movement. ●Ergonomic design, convenient and comfortable to operate. ●Multi-band laser application, fast switching and accurate cutting. ●Compatible with high power metallographic microscope for fine adjustment and movement. ●No backtrip difference design, accurate positioning. ●The air cooling structure is compact and requires no maintenance. ●High precision system, laser machining accuracy up to 1*1um. ●Leading internal anti - shock system device, more stable operation.


    Model FA series
    Specification 
    Model FA-8 FA-8-SC
    Dimension L: 960mm*W: 850mm*H: 1500mm L: 880mm*W: 860mm*H: 1550mm
    Weight (about) 260KG 280KG
    Electricity Demand 220VC, 50~60Hz
    Chuck  Size & Rotation angle  8", 360° Rotation
    X-Y travel range  8" * 8"  
    Moving resolution  1μm
    Sample fixed mode  Vacuum adsorption Vacuum adsorption
    Temperature control range - - 80~200
    Quick pull out - yes
    Electrical design Chuck Surface is Electrical Floating with Banana
     plug adapter, can be used as a backside electrode.  
    Platen Specification U shape Platen, 10 micropositioners available O shape Platen, 12 micropositioners available
    Travel & adjustment mode Platen can be quickly lifted up and down 6mm with automatic locking function,Platen can be fine 
    tuned up and down 25mm precisely with 1μm resolution   
    Microscope Travel range X-Y: 2" * 2",            Z: 50.8mm X-Y: 1" * 1",            Z: 50.8mm
    Resolution 1μm
    Magnification 20 ~ 4000X
    Operation of lens switching                    Fast tilting Pneumatic lifting
    CCD pixels 50W (Analog) / 200W (Digital) / 500W (Digital)
    Laser Wavelength Wavelength selectable: 1064/532/355/266nm
    Output power 0~2.2mJ/pulse 
    Micromachining capability Machinable material: Cr / Al / ITO / Ni / TFT / RGB / Poly Silicon / Mo / SiN / CF internal impurity etc.
    Precision Minimum Machinable size is 1*1μm (when using 100X lens)
    Cooling mode Air-cooled laser or Water cooled laser
    Micropositioner  X-Y-Z moving range 12mm-12mm-12mm / 8mm-8mm-8mm
    Mechanical resolution 2μm / 0.7μm / 0.1μm 
    Current leakage accuracy  10pA / 100fA (with Shielding Box)
    Cable connectors Banana head / Crocodile clip / Coaxial / Triaxial 
    Optional Accessories  Chuck fast pull-out mechanism
    Hot spot detection by liquid crystal package
    High voltage / high current test suite
    Hot chuck
    Shielding box
    Special adapter
    Vibration free table
    Gold-plated chuck
    Coaxial / Triaxial chuck
    Chuck Z quickly lifting and lowering and fine adjustment selection
    Light intensity / wavelength test
    RF test accessories
    Active probe
    Low current / Capacitance test
    Fixture for Fibre optic coupler test 
    Fixture of Packaged IC test accessory
    Fixture of PCB test accessory 
    Special Custom design
    Application Failure analysis of IC/LCD/OLED in varing temperature environment
    Characteristic
    Failure analysis                             Comfortable large handle, Driver Screws: Zero back lash 
    Chip hot spot detection by liquid crystal                             Internal circuit/ electrode/ PAD probe 
    Laser cut ,ablation and selectively remove                             RF Devices characteristic 
    Applicable to the internal line modification /
    repair of the IC/LCD panel
                               IV / CV characteristic test and failure analysis of Materials / Devices
    Up to 12 inch wafer testing                            Laser minimum machining size 1*1μm

    Customer Service
    Procurement Messages

    Contact number

    0755-2690 6952 turn 801/804/806/814

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