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Product Overview Functional structure Specifications Download
FA Series Failure Analysis Probe Station

Product Overview

FA series probe bench is a kind of measuring equipment specially designed for failure analysis laboratory. It has optical characteristic, laser characteristic, stable equipment structure, excellent system performance, ergonomic design, convenient operation, support multi-function upgrade, and rich and complete product functions.

Basic Information

Product number FA8 working environment Open type
electricity demand 220VC,50~60Hz Control method Manual Probe Station
Product Size 960mm long *850mm wide *1500mm high equipment weight About 260 kg

Application direction

Chip Failure Analysis AT room temperature and high and low temperature rf device Failure analysis MATERIAL/device IV/CV characteristic test and Failure analysis Chip internal circuit/electrode /PAD test IC/ panel internal circuit modification/layer removal.

Technical characteristics

Product Feature

●Large handle drive, no clearance movement. ●Ergonomic design, convenient and comfortable to operate. ●Multi-band laser application, fast switching and accurate cutting. ●Compatible with high power metallographic microscope for fine adjustment and movement. ●No backtrip difference design, accurate positioning. ●The air cooling structure is compact and requires no maintenance. ●High precision system, laser machining accuracy up to 1*1um. ●Leading internal anti - shock system device, more stable operation.


Model FA series
Model FA-8 FA-8-SC
Dimension L: 960mm*W: 850mm*H: 1500mm L: 880mm*W: 860mm*H: 1550mm
Weight (about) 260KG 280KG
Electricity Demand 220VC, 50~60Hz
Chuck Size & Rotation angle 8", 360° Rotation
X-Y travel range 8" * 8"
Moving resolution 1μm
Sample fixed mode Vacuum adsorption Vacuum adsorption
Temperature control range - - 80~200
Quick pull out - yes
Electrical design Chuck Surface is Electrical Floating with Banana
plug adapter, can be used as a backside electrode.
Platen Specification U shape Platen, 10 micropositioners available O shape Platen, 12 micropositioners available
Travel & adjustment mode Platen can be quickly lifted up and down 6mm with automatic locking function,Platen can be fine
tuned up and down 25mm precisely with 1μm resolution
Microscope Travel range X-Y: 2" * 2",            Z: 50.8mm X-Y: 1" * 1",            Z: 50.8mm
Resolution 1μm
Magnification 20 ~ 4000X
Operation of lens switching Fast tilting Pneumatic lifting
CCD pixels 50W (Analog) / 200W (Digital) / 500W (Digital)
Laser Wavelength Wavelength selectable: 1064/532/355/266nm
Output power 0~2.2mJ/pulse
Micromachining capability Machinable material: Cr / Al / ITO / Ni / TFT / RGB / Poly Silicon / Mo / SiN / CF internal impurity etc.
Precision Minimum Machinable size is 1*1μm (when using 100X lens)
Cooling mode Air-cooled laser or Water cooled laser
Micropositioner X-Y-Z moving range 12mm-12mm-12mm / 8mm-8mm-8mm
Mechanical resolution 2μm / 0.7μm / 0.1μm
Current leakage accuracy
Coaxial 1pA/V @ 25 ℃; Three shaft 100fA/V @ 25 ℃; Triaxial 10pA@3kv @25°C,
Test conditions: dry environment for grounding shield (air dew point lower than - 40 ° C)
Cable connectors Banana head / Crocodile clip / Coaxial / Triaxial
Optional Accessories Chuck fast pull-out mechanism
Hot spot detection by liquid crystal package
High voltage / high current test suite
Hot chuck
Shielding box
Special adapter
Vibration free table
Gold-plated chuck
Coaxial / Triaxial chuck
Chuck Z quickly lifting and lowering and fine adjustment selection
Light intensity / wavelength test
RF test accessories
Active probe
Low current / Capacitance test
Fixture for Fibre optic coupler test
Fixture of Packaged IC test accessory
Fixture of PCB test accessory
Special Custom design
Application Failure analysis of IC/LCD/OLED in varing temperature environment
Failure analysis Comfortable large handle, Driver Screws: Zero back lash
Chip hot spot detection by liquid crystal Internal circuit/ electrode/ PAD probe
Laser cut ,ablation and selectively remove RF Devices characteristic
Applicable to the internal line modification /
repair of the IC/LCD panel
IV / CV characteristic test and failure analysis of Materials / Devices
Up to 12 inch wafer testing Laser minimum machining size 1*1μm

Customer Service
Request for quotation Request for quotation
Contact number

Contact number

0755-2690 6952 turn 801/804/806/814

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