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News in Wafer Tester Advancements - SEMISHARE Prober

Stay on the cutting edge of wafer test technology and advancements in wafer testers with SEMISHARE Prober's corporate news updates. Explore the latest trends.

Headline: Advanced Wafer Testing - Key to Process and Design Improvements

The Growing Wafer Test Complexities

The relentless miniaturization scaling of integrated circuits to few process geometries now demands unprecedented verification intricacies earlier through wafer test seeking deep insights continuously at multi-operation points aiding opportunities improvements identifications across next nodes migrations. This evolution in the semiconductor industry has significantly increased the complexity of wafer testing. Wafer testers now play a more crucial role than ever in ensuring the functionality and efficiency of these densely packed circuits. As the industry moves towards smaller geometries and 3D architectures, the challenges for wafer testers become more pronounced. They must now not only validate transistors themselves but also ensure the integrity of stacked integration and high-density packaging. Microwave interconnects testing interconnections using testers on fabrication wafers becomes pivotal in determining functionality, yields, and repeatability confidence before commitments seeking risk reductions. This shift necessitates advanced wafer testers capable of handling these intricate structures while maintaining high throughput and accuracy. The role of wafer testers in identifying potential issues early in the manufacturing process is becoming increasingly vital, as it directly impacts the overall yield and cost-effectiveness of semiconductor production.

Innovations in Wafer Test Techniques

Keeping pace requires blanket wafer test innovations through emerging methodologies transformations. The semiconductor industry is witnessing a paradigm shift in wafer testing techniques, driven by the need for more efficient and comprehensive testing methodologies. Concurrently testing multi-dice using adaptable probe sequencing shortens validation times through massive parallelism. This approach significantly enhances the capabilities of wafer testers, allowing them to handle multiple dies simultaneously, thereby reducing the overall testing time. Incorporating holistic wafer microscopy down to nanometrics augments traditional electrical testing for materials fit-for-use assessments. This integration of advanced imaging techniques with traditional wafer testers provides a more holistic view of the wafer, enabling more accurate and detailed analysis. Online analytics, augmented data visualization, and smart self-learned measurements manifesting resource optimal selections constitutes additional wafer tester enhancements producing informed actions further multiplying productivities. The incorporation of AI and machine learning algorithms into wafer testers has revolutionized the way testing is conducted. These smart systems can now analyze vast amounts of data, learn from it, and make informed decisions, thereby optimizing the testing process and enhancing productivity.

SEMISHARE Next-Gen Wafer Test Leadership

Pioneering such wafer probing advances, SEMISHARE delivers breakthrough time-multiplexed self-configuring pad engagements solutions powered by years of focused development cultivating interdisciplinary hardware competencies. SEMISHARE's leadership in next-gen wafer testing is marked by its innovative approach to tackling the evolving challenges in semiconductor testing. The company's non-contact laser-based dynamic alignment systems with submicron landing precision constitute the core of our versatile next-generation automated wafer testers designs enhancing positioning productivities. This technology represents a significant leap in wafer tester capabilities, offering unparalleled precision and efficiency. Unmatched probe and manipulator selections flexibility backed by custom building skills further augments the wafer test boundaries expansions unlocking widest measurements possibilities empowering our customers undeterred pursuing the next validation challenge armed with advanced testers matching the applications sustenance milestones! SEMISHARE's commitment to innovation is evident in its ability to provide customized solutions that push the boundaries of what is possible in wafer testing. The company's advanced wafer testers are designed to meet the specific needs of its clients, ensuring that they are equipped with the best tools to tackle the challenges of modern semiconductor testing.

Co-Driven Technology Partnerships

Aligning with long-term industrial technology shifts, sustained engagements create information exchanges allowing both faster innovations and focused budget allocations suiting specific commercialization objectives. In the rapidly evolving semiconductor industry, collaboration and partnerships are key to driving innovation and meeting the complex demands of modern wafer testing. Sharing real test challenges encountered helps guide newer analysis developing methodologies expansions tailored to applications. These collaborations between SEMISHARE and its partners lead to the development of new methodologies and wafer testers that are specifically designed to address the unique challenges faced by the industry. Such commitments create future wafer test solutions execution roadmaps manifesting ambitious validation coverage milestones demonstrating deeper mutual success benefiting the global semiconductor measurements advancements further! These partnerships not only foster innovation but also ensure that the solutions developed are in line with the industry's long-term goals, thereby contributing to the overall advancement of semiconductor technology.

 
 

How to achieve accurate, fast and automated wafer test

Release time:2021-12-08Source: semishare

Driven by Moore's Law, integrated circuits are also greatly reducing circuit size, volume and cost, and continuously improving processing speed and performance. The continuous advancement of aerospace, the development trend of automobile electrification, and the arrival of the 5G era, how to ensure stable operation in various complex environments, all of which have put forward higher requirements for the new generation of integrated circuits, and wafer testing has also changed. It gets more complicated. As the amount of semiconductor investment continues to increase, the tolerance for design errors is almost zero, so strict verification tests must be carried out before the chip enters mass production and during mass production.

WAT (Wafer Acceptance Test) test is an important site for wafer manufacturing. It is used in conjunction with a probe station and a tester. It is used to test the testkey  on the completed wafer for electrical testing. Generally, sampling tests are performed (5 points or more per wafer). If some important parameters do not meet the requirements, the wafer will be scrapped and will not enter the next stage. The WAT test reflects the stability of the wafer factory's processing technology.

CP (Chip Probing) test is used in conjunction with a probe station and an ATE tester to test the functions and electrical parameters of the chips on the wafer. The probe station is responsible for the transportation and positioning of the wafer, ensuring that the surface of the wafer is moved to the precision The instrument delivers a more stable signal, so that the Dies on the wafer are in contact with the probes and tested one by one (or in parallel) to achieve more accurate data testing and measurement. After the completion of the wafer production, due to various manufacturing defects introduced due to process reasons, there will be a certain amount of unqualified products in the Die distributed on the wafer. The purpose of CP testing is to find out these unqualified products before packaging. On the one hand, it analyzes the cause of failure, so as to increase the yield of the product subsequently, and on the other hand, reduce the cost of subsequent packaging and testing.


With the rapid development of global informatization, networking and knowledge economy, semiconductor products are also constantly undergoing innovation and technological iteration. The pressure from the market forces engineers and scientists to constantly update their technologies, reduce the time to market, and leave the wafer test time for fabs or laboratories more tight and precious. In the process of WAT test and CP test, how does the probe station, which plays an important role, meet the needs of engineers? SEMISHARE has intensively cultivated the probe station industry for more than ten years and is one of the few domestic manufacturers with independent technology and production strength. The A12 developed by SEMISHARE is a 12-inch (8-inch compatible) mass production fully automatic wafer probe station. The equipment can be combined with different types of Parametric and ATE test units. Precise contact between them to complete wafer WAT/CP testing. The equipment is easy to operate and has good mechanical stability. It can provide customers with a cost-effective and high-yield wafer testing solution to meet the requirements of (fabs, Packaging and testing plants, testing plants) and other test requirements of different customers.


Self-developed software, simple and easy to operate, can realize 7×24 hours unattended

The self-developed software system has strong compatibility, powerful functions and simple operation, which is very friendly to novice operators. The measurement job can be put into operation at night or on weekends. Through high-resolution and high-precision temperature control, all devices on the wafer can be tested at different temperatures without operator intervention. If the probe deviates from the state of alignment with the Pad, the system will automatically realign them to save test time. It has a powerful Wafermap editing function and supports offline and file import and export functions.

Vision automatic and precise calibration

In the test situation, the precise placement of the light is crucial, and the vision is automatically and precisely calibrated, which can reduce the test time from several months to a matter of minutes in some cases. The self-designed upper and lower microscope system, unique upper and lower focusing and centering optical technology, and 4 sets of 2 million pixel high-definition digital cameras, precision pneumatic upper microscope structure, ensure that the calibration and needle sticking are in the same area, and each microscope is With high and low magnification, it can meet the needs of high-precision alignment and needle point recognition.

High strength and low center of gravity design structure, high precision and test speed, greatly improve test efficiency

Multi-directional environmental monitoring and compensation functions to solve the position accuracy changes caused by temperature and humidity changes.High-precision XYZR four-dimensional platform, XYZ accuracy up to ±1μm, R accuracy up to 0.0001°, 0.1μm resolution grating ruler, to ensure ultra-high precision motion performance. The machine frame with integrated casting and long-term aging treatment can realize 7×24 hours of uninterrupted work. The movement rate of the XY axis can reach 200mm/s, which greatly improves the test efficiency.

The core of realizing accurate, fast and automated wafer testing is to enable our equipment to operate autonomously according to the set requirements through continuous innovation of software and hardware technologies, to achieve more precise contact and shorten the time of data acquisition. SEMISHARE has been committed to provide our customers with professional test and measurement solutions.





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