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    X12 "Semi-Automatic Probe Station

    Product Overview

    X series is an integrated and highly efficient semi-automatic wafer probe platform that is specialized in testing the performance of various advanced chips. It integrates various functions such as electric light wave and microwave, etc. It has the highest temperature width and test accuracy in the industry at present, and can match various test application environments, providing reliability wafer testing within -60 ~300 wide temperature range. ***Custom design solutions for special dimension or performance are possibile on request***

    Basic Information

    Product number X12 working environment Open type
    electricity demand 220V,50~60Hz Control method Semi-Automatic
    Product Size 1200mm*1600mm*1400mm equipment weight About 1350 kg

    Application direction

    Equipment professional deal with 12 "8" 6 "wafer Si/GaN/SiC and other kinds of devices of advanced chip performance test, can be equipped with corresponding instruments and meters, for the I - V C - V light RF signal character such as 1 / f noise analysis, feature-rich devices, scalable high-power wafer test RF test automatic test, and can load temperature control system, satisfy the customer in the high and low temperature environment of all kinds of wafer device performance test requirements.

    Technical characteristics

    The industry's most efficient CHUCK system, test efficiency increased by more than 40%

    ● The industry's most efficient CHUCK test system running speed & GT;70mm/s, motion precision 1 m, while moving the translocation time index time 500ms, excellent system operating parameters have reached the highest level of the industry, ultra-high test accuracy and efficiency to meet all kinds of wafers and devices of high repeatability and stability test, compared with other probe brands in the industry, the test efficiency is effectively increased by more than 40%. ●-60 ~300 is the highest temperature wide area in the industry, with temperature control accuracy and stability better than 0.08, providing reliability wafer testing in high and low temperature environments. ●The compact structure design of four-dimensional motion with low center of gravity ensures the motion speed of 70mm/s while maintaining the stability of motion acceleration and deceleration.

    Industry leading 3 times imaging technology

    Built-in SEMISHARE patent more than three zoom microscope view three times with JiaoGuang road system, 120 x 2000 x variable times optical amplifier, size view shows at the same time, more can make the point needle and convenient operation, double Basler 2 million pixels high speed CCD 23 "display and Mituyoyo high precision high resolution camera, precision positioning of high stability high definition, image output and high precision measurement and dynamic monitoring.

    Auxiliary CHUCK module silicon wafer safe upper and lower

    ●The unique Chuck XY axis design in the industry has changed the common phenomenon that the probe system of other brands in the market is affected by the resistance of laminated plates in different directions and sizes, leading to the decline of motion stability.This ensures that the XY axis is not affected by the laminate when moving, making the motion precision and stability higher. ●Compared with other brands in the industry, the probe table cavity of SEMISHARE can be opened once and pulled out the entire Chuck mechanism to load and load silicon wafers at a speed of 370mm with a long stroke. The manual feeding of the Wafer is more convenient and faster.Meanwhile, the Chuck's rotation Angle range is larger, which requires lower demand for manual laying wafer, and the operation is more flexible and convenient.

    Design of O-type needle seat platform

    The probe testing system adopts the O-type needle seat platform design, which makes the most efficient use of the space of the needle seat, up to 12 needle seats can be placed at the same time. Compared with other probe brands in the market, the number of the needle seat is increased by 50%, effectively realizing more efficient and rapid testing.

    Air film shock absorption system

    The industry's unique internal integration of high-performance air film shock absorption system and the dual design of the external isolation barrier, effectively avoid the vibration caused by the operator's touch;In addition, a long-aging casting is used as the substrate to suppress the vibration in the process of motion at the fastest speed of 1S in the industry to ensure the stable operation of the equipment, and to ensure that the screen does not shake when the image is enlarged at 2000X;At the same time, the high-precision control valve ensures that the height error of the moving part of the platform is 0.1mm, effectively realizing the test ability of fast DIE to die, ensuring that the whole system can still maintain a stable running state when moving at a high speed, and greatly improving the test efficiency.

    Anti-interference shielding system

    Anti interference EMI/Spectral noise/external light closed shielding cavity, cavity with the surface of conductive oxide and nickel plating process, to ensure the conduction state between the parts so as to achieve the shielding effect, reduce the system noise, blocking interference effectively, and provide low leakage current protection, provides the best test environment for the weak electric signal test;At the same time, the closed chamber in the low temperature environment to avoid the test sample condensation, to ensure the wafer and device under the high and low temperature environment fast and safe reliability test.

    Independent research and development of software integration system, more compatibility

    ●Support semi-automatic control (manual test or automatic test). ●Automatic Wafer calibration automatic Wafer mapping automatic die size measurement automatic align automatic test data can be accessed remotely. ●Automatic calibration of RF probe module with one key, automatic needle clearing function. ●One-key adaptive four-axis Chuck precision calibration, supporting micron pad point measurement. ●Single point or continuous testing can be supported. ● Strong data storage capacity and data processing capacity. ●The bin value can be divided to determine the device NG. ●Multi-system integration to upgrade the operating system application system and device test system independently. ●Intuitive and simple operation design, quick and easy operation, effective saving operation training time.

    Flexible optional configuration and extension

    Convenient instrument access and support system automatic expansion and upgrade, temperature control system loading;There are also a variety of test modules available. According to the test module, it can be used together with a variety of positioner fixtures, needle CARDS and probe tables, such as six-axis positioner RF cables.Many system operating parameters and features reach the highest level of the industry, can meet your different test needs, but also an ideal choice for more industry customers a semi-automatic probe table equipment.

    SX Series Semi-automatic Wafer Probe Station
    Specification
    Model SX-6 SX-8 SX-12
    Dimension(W*L*H) 1000mm * 1400mm * 1400mm 1100mm * 1500mm * 1400mm 1200mm * 1600mm * 1400mm
    Weight(about) 1000KG 1150KG 1350KG
    Electricity Demand AC220V,50~60Hz
    CDA demand 0.4~0.8Mpa
    Chuck Size 6″ 8″ 12″
    X-Y Travel range 200mm * 300mm 250mm * 400mm 350mm * 500mm
    X-Y Resolution 0.1μm
    X-Y Repeatability ≤±1μm
    X-Y Move speed ≥70mm/sec(Optional for 100mm/sec , 200mm/sec )
    Z    Travel range 20mm
    Z    Resolution 0.1μm
    Z    Repeatability ≤±1μm
    Z    Move speed ≥20mm/sec
    Theta Travel range ±10° Theta resolution 0.0001°
    Sample Fixed mode Vacuum adsorption , Independent control
    Sample Exchange Chuck quickly roll out for wafer fast exchange.
    Structure Triaxial ultra-low noise design,Gold plating, Chuck surface is electrical floating
    Platen Specifications O shape platen, 12 micropositioners available(When the octagon box is not installed)

    Microscope

    X-Y-Z

    X-Y  Travel range 2″* 2″
    X-Y  Resolution 0.1μm
    X-Y Repeatability ±2μm
    X-Y Move speed ≥10mm/sec
    Z     Travel range 5″
    Z     Resolution 0.1μm
    Z     Repeatability ≤ ±1μm
    Z     Move speed ≥10mm/sec
    Microscope Variable magnification microscope Zoom:15:1,Three gears and could display low(0.6X) and high(2.5X or 9X)
    magnification in the same time
    Camera Double cameras(200W or 500W Industrial digital camera)
    Micropositioner Specification Mechanical resolution 10μm / 2μm / 0.7μm
    X-Y-Z Move range 13mm-13mm-13mm
    Current leakage 10pA / 100fA / 10fA
    Connector type Banana plug adapter/Coaxial /Three-axis/ SMA /SHV etc.
    Base Magnetic/vacuum adsorption base

    Temperature

    specification

    Temperature range ﹣60℃-200℃ (Standard), other Temperature range upon request
    Temperature stability ±0.1℃
    Tmeperature resolution 0.01℃
    Heating time(12″chuck) ﹣60℃ to +25℃ ≤ 10min
    +25℃ to +200℃ ≤10 min
    Cooling time(12″chuck) ﹢200℃ to +25℃ ≤ 12min
    ﹢25℃ to -60℃ ≤ 25min
    Noise <60dB
    Heating method Low Voltage DC(LVDC)/PID control
    Refrigeration method Refrigeration compressor
    Anti-Vibration Anti-Vibration method Air film anti-vibration system,Ensure nonvisible vibration in the screen
    when the microscope zooming in at 2000X
    Vibration suppression In the process of chuck movement, it can be extremely fast to ensure the
    stability of the chuck ≤1S, Improve the test efficiency.
    system mask EMI shielding > 30 dB (typical) @ 1 kHz to 1 MHz
    Light attenuation ≥ 130 dB
    Spectral noise floor ≤ -180 dBVrms/rtHz(≤1MHz)
    System AC noise ≤5 mVp-p (≤ 1GHz)
    Software function
    Automatic wafer alignment Automatic wafer height measurement and compensation
    Automatic Die size measurement and auto mapping Wafer map edit arbitrary
    Demarcate difference data with Ink mark Real-time test results display
    Easy data management of the instrument input/output The test results can be divided into different bin values
    Multi tester fast integration , support both single Die testing and continuous testing Support Z, N shape test
    One touch automatic RF calibrate and probe tips cleaning Separation of OS and application software, can be upgraded independently.
    Robust data storage and processing capabilities Automatic data and curves storage and remote access
    Communication interface:R232/485/TCP/IP/GPIB
    Characteristic
    Ultrahigh test accuracy, efficiency and stability Convenient tester integration
    Mult magnification simultaneous display optical system High power wafer test Upgradable
    -60~200℃ super low noise chuck RF test Upgradable
    Feature-rich test software. Fully automatic wafer test Upgradable
    Customer Service
    Procurement Messages

    Contact number

    0755-2690 6952 turn 801/804/806/814

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