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Advanced Manual Probers Solutions - SEMISHARE Prober

Embark on a journey of semiconductor testing finesse with our manual prober collection. Dive into SEMISHARE Prober's unique manual prober solutions for precision.

SEMISHARE: Pioneering Manual Prober Technology in Semiconductor Testing

In the intricate world of semiconductor testing, precision and reliability are paramount. SEMISHARE's H Series Integrated Manual Probe Station stands at the forefront of manual prober technology, offering unparalleled performance for a wide range of semiconductor testing applications. This article delves into the nuances of manual probers, their critical role in semiconductor development, and the innovative features that set SEMISHARE's technology apart.

Understanding the Manual Prober

A manual prober, the cornerstone of semiconductor testing in many research and development settings, is a sophisticated device designed for hands-on electrical testing of semiconductor wafers and chips. Unlike automated systems, a manual prober allows for direct user control, making it invaluable for detailed analysis and specialized testing scenarios.

Key Components of a Manual Prober:

1. Probe Platen: The platform where probe positioners are mounted.

2. Chuck: A specialized stage that holds the wafer or device under test.

3. Microscope: For visual inspection and precise probe placement.

4. Probe Positioners: Mechanical arms for precise probe movement.

5. Vibration Isolation System: To minimize external disturbances.

SEMISHARE's H Series manual prober integrates these components with advanced technologies, creating a system that excels in precision, stability, and user-friendliness.

The Evolution of Manual Prober Technology

Manual probers have come a long way since their inception. Early models were basic mechanical devices with limited precision. Today's manual probers, like SEMISHARE's H Series, incorporate advanced materials, precision engineering, and sophisticated control systems.

Key advancements in manual prober technology include:

1. Improved Positioning Accuracy: From millimeter to sub-micron precision.

2. Enhanced Vibration Isolation: Using active and passive damping systems.

3. Integration of Digital Imaging: For real-time visual feedback.

4. Advanced Chuck Technologies: Including thermal control and air-bearing systems.

5. Software Integration: For data collection, analysis, and process automation.

SEMISHARE's Innovations in Manual Prober Design

Chuck Air Bearing Move Technology

This groundbreaking feature in SEMISHARE's manual prober revolutionizes wafer handling:

1. Frictionless Movement: Allows for smooth, precise wafer positioning.

2. Reduced Contamination: Minimizes particle generation during movement.

3. Enhanced Throughput: Enables faster repositioning between test points.

4. Improved Accuracy: Eliminates stick-slip effects common in mechanical systems.

The air bearing system uses a thin film of pressurized air to float the chuck, reducing friction to near-zero levels. This not only improves positioning accuracy but also extends the life of the chuck mechanism.

Large Handle Differential Head Drive

This ergonomic innovation significantly enhances user experience and precision:

1. Intuitive Control: Large handles provide better tactile feedback.

2. Fine Adjustment: Differential mechanism allows for micrometer-level adjustments.

3. Reduced Operator Fatigue: Ergonomic design for extended use.

4. Increased Stability: Minimizes unintended movements during adjustment.

The differential head drive combines coarse and fine adjustment capabilities, allowing operators to make precise movements with ease. This is particularly crucial when working with dense semiconductor layouts.

Microscope Air-Controlled Lifting Control

This feature enhances both functionality and safety:

1. Smooth Vertical Movement: Precision air control for focus adjustments.

2. Collision Prevention: Automated safeguards to prevent accidental contact.

3. Extended Working Distance: Facilitates easier wafer and probe manipulation.

4. Rapid Objective Changes: Streamlines workflow for different magnification needs.

The air-controlled system provides a level of control and safety not possible with manual lifting mechanisms, ensuring the delicate balance between close observation and wafer protection.

Three-Stage Lifting Needle Base Platform

This advanced system offers unparalleled flexibility in probe positioning:

1. Rapid Height Adjustment: Quick transitions between test, separation, and loading positions.

2. Micrometer-Level Precision: Fine control for exact probe placement.

3. Consistent Repeatability: Ensures reliable results across multiple tests.

4. Enhanced Safety Features: Incorporates locks to prevent accidental movements.

The three-stage system allows for both rapid gross adjustments and ultra-fine positioning, catering to a wide range of testing scenarios.

Applications of Manual Probers in Modern Semiconductor Testing

Manual probers find applications across various sectors of the semiconductor industry:

1. Research and Development

- New Material Characterization: Testing electrical properties of novel semiconductor materials.

- Device Prototyping: Evaluating performance of experimental chip designs.

- Failure Analysis: Identifying and analyzing defects in semiconductor devices.

2. Low-Volume Production

- Custom IC Testing: For specialized or small-batch integrated circuits.

- MEMS Device Evaluation: Testing micro-electromechanical systems.

- Photonic Device Characterization: Analyzing optoelectronic components.

3. Educational Institutions

- Hands-on Training: Teaching semiconductor testing principles to students.

- Academic Research: Supporting cutting-edge studies in microelectronics.

4. Quality Control

- Spot-Checking: Verifying the quality of production batches.

- Process Validation: Ensuring manufacturing processes meet specifications.

5. Specialized Testing Environments

- High/Low Temperature Testing: Evaluating device performance under extreme conditions.

- High-Frequency Testing: Characterizing RF and microwave devices.

- High-Power Device Testing: Assessing performance of power semiconductors.

SEMISHARE's manual prober excels in these applications, offering the flexibility and precision needed for diverse testing requirements.

The Role of Software in Manual Prober Operations

While the physical components of a manual prober are crucial, the software interface plays an equally important role:

1. Test Pattern Generation: Creating custom test sequences for specific devices.

2. Data Acquisition and Analysis: Collecting and processing test results in real-time.

3. Probe Positioning Control: Assisting in precise probe placement and movement.

4. Environmental Monitoring: Tracking and controlling test conditions.

5. Integration with External Instruments: Coordinating with other test equipment.

SEMISHARE's prober software is designed for intuitive operation while offering advanced capabilities for data management and analysis.

As semiconductor technology continues to advance, manual probers are evolving to meet new challenges:

1. Increased Automation: Integration of automated features for repetitive tasks.

2. Enhanced Resolution: Pushing the boundaries of probe positioning accuracy.

3. Advanced Materials: Incorporating new materials for improved performance and durability.

4. IoT Integration: Connecting probers to the broader manufacturing ecosystem.

5. AI-Assisted Testing: Implementing machine learning for test optimization and fault detection.

SEMISHARE is at the forefront of these developments, continuously refining its manual prober technology to meet the evolving needs of the semiconductor industry.

In the rapidly evolving field of semiconductor technology, the role of precise and reliable testing equipment is more critical than ever. SEMISHARE's H Series Integrated Manual Probe Station represents the pinnacle of manual prober technology, offering unparalleled precision, versatility, and user-friendliness.

From its innovative Chuck Air Bearing Move Technology to its ergonomic Large Handle Differential Head Drive, every aspect of SEMISHARE's manual prober is designed to enhance the testing process. Whether used in cutting-edge research laboratories, educational institutions, or specialized production environments, this manual prober provides the tools necessary to push the boundaries of semiconductor technology.

As the semiconductor industry continues to advance, with devices becoming smaller, more complex, and more powerful, the need for sophisticated testing equipment grows. SEMISHARE's commitment to innovation ensures that its manual prober technology evolves in tandem with these industry developments, providing researchers and engineers with the tools they need to shape the future of electronics.

For those seeking to elevate their semiconductor testing capabilities, SEMISHARE's manual prober offers a compelling solution. Its combination of precision, flexibility, and advanced features makes it an indispensable tool in the quest for semiconductor innovation and quality assurance.

To learn more about how SEMISHARE's manual prober can enhance your semiconductor testing processes, visit our website at https://www.semishareprober.com/. Discover the difference that precision, reliability, and innovation can make in your semiconductor testing endeavors.

製品概要 機能構造 仕様 ダウンロード ビデオ
Hシリーズ 統合手動プローブステーション

製品概要

Hシリーズはハイエンド統合手動テストプローブシステムで、業界他ブランドを凌駕する優れた安定性・操作性・測定精度を実現。独自の空圧チャック移動技術、柔軟なUPStartモジュラー構造設計、強化型耐振システムなど、SEMISHAREの業界をリードする先進的イノベーション技術を集約しています。同時に、本装置は後継の拡張・アップグレードをサポートし、多様なテストアプリケーションにおける顧客のニーズに対応可能です。現在および将来において、顧客のテスト要件が増加または変化する場合でも、機器の再構成とアップグレードが可能で、真の「多機能1台化」を実現します。大学の研究開発センターや研究所におけるワンストップ予算調達・投資に最適な装置です。

基本情報

製品番号 H6/H8/H12 作業環境 オープン型
電力需要 220V,50~60Hz 制御方法 手動プローブステーション
製品サイズ 1300MM long *920MM wide *920MM high 機器重量 約300kg

応用方向

ナノマイクロデバイスの科学研究・分析、抜き取り検査などに適しており、ウェハ上のチップ回路を迅速に分析・テストし、電気的特性パラメータから製品性能を判断できます。これにより、チップ欠陥による製品への損失を低減し、歩留まり向上を実現。さらにRF特性テストや光ファイバースペクトル特性テストの実施・アップグレードも可能です。

技術的特徴

>チャック空気軸受移動技術

空気圧式可動プラットフォームはチャック高速移動機能を備え、対応するエアフロートスイッチにより効率的な手動テストの要求を満たします。3種類の高速移動方式を提供:1.片手操作によるX/Y方向高速移動 2.両手操作によるサンプル全面高速移動 従来のボール/ベアリング式サンプルステージではX/Y軸単方向移動のみ可能で、移動速度も低速でした。通常のエアフロートステージではサンプルステージの全面高速移動は可能ですが、X/Y軸単方向の精密位置決めが不可能で、生産測定の要求を満たせません。当社の3段階エア制御サンプルステージは、これら2つの機能を完璧に統合・実現しています。

>大型ハンドル差動ヘッド駆動方式

チャック可動プラットフォームは微調整機能を装備し、業界トップクラスの日本ミツトヨ製大型ハンドル差動ヘッドで駆動。従来の差動ヘッドに比べ小型で、操作感が滑らかでバックラッシュのない調整が可能。これにより、超スムーズな手動テストを実現し、テスト効率を向上させるとともに、お客様のテストコスト削減に貢献します。

>顕微鏡空圧式昇降制御

顕微鏡は空圧制御により50mmの昇降が可能。高品質バルブ制御と高圧空気入出力の絞り微調整により、スムーズな昇降を実現。これにより対物レンズの交換が容易になるだけでなく、テスト中の対物レンズと治具の偶発的接触損傷を効果的に防止します。

> 三段式リフティングニードルベースプラットフォーム

ニードルベースプラットフォームは急速昇降(0/300μm/3mm)+微調整(40mm、移動分解能2~5μm)が可能。プラテン全パーツが同時昇降(不同現象なし)でき、昇降後もパッド上のニードルマークのX/Y/Z方向繰り返し精度は他社比1μm以下を達成。この繰り返し精度1μmのニードルベースプラットフォームは、接触・分離(300μm)・ローディング(3mm)の3段階離散位置を備え、安全ロック機構によりプローブやウェハの偶発的損傷を防止。直感的な制御と正確な接触位置決めを実現し、高周波・高電力テストにおける高精度測定を可能にします。

> 搭載可能レーザー

マルチバンドレーザーカッティングシステムは、ほとんどの故障解析用顕微鏡に搭載可能です。精密切削と選択的材料除去を実現する高信頼性の先進レーザー伝送システム(ABDS)を採用し、異なる材料の切削・切断作業に適したバンドを選択可能。レーザー出力エネルギー2.7mJ、最大エネルギー調整可能、300シリーズ水循環冷却構造によりシステムのコンパクト化とメンテナンスフリーを実現しています。

Title

H series
Specification
Model H6 H8 H12
Dimension L: 820mm*
W: 720mm*
H: 890mm
L: 960mm*
W: 850mm*
H: 900mm
L: 1300mm*
W: 920mm*
H: 920mm
Weight (about) 170KG 230KG 300KG
Electricity Demand 220VC, 50~60Hz
Chuck Size & Rotation angle 6", 360° Rotation 8", 360° Rotation 12", 360° Rotation
X-Y Travel range 6" * 6" 8" * 8" 12" * 12"
Moving resolution 1μm
Sample fixed mode Vacuum adsorption
Electrical design Electrical Floating with Banana plug adapter, can be used as a backside electrode
Platen U shape platen 6 micropositioners available 8 micropositioners available 12 micropositioners available
Move range & adjustment mode Platen can be quickly lifted up and down 6mm for fast probe tip seperation
Platen can be fine tuned up and down 25mm precisely with 1μm resolution
Microscope Travel range X-Y axis : 2" * 2",  Z axis : 50.8mm
Moving resolution 1μm
Switching object lens Microscope tilting 30°manually by Lever
Magnification 20~4000X
Lens specification Eyepiece: 10X ; Objective lens : 5X, 10X, 20X, 50X 100Xoption
CCD pixels 50W (Analog) / 200W (Digital) / 500W (Digital)
Micropositioner specification X-Y-Z Travel range 12mm-12mm-12mm / 8mm-8mm-8mm
Mechanical resolution 10μm / 2μm / 0.7μm / 0.1μm
Current leakage accuracy
Coaxial 1pA/V @ 25 ℃; Three shaft 100fA/V @ 25 ℃; Triaxial 10pA@3kv @25°C,Test conditions: dry environment for grounding shield (air dew point lower than - 40 ° C)
Cable connectors Banana head / Crocodile clip /  Coaxial / Triaxial
Application

Wafer test, Photoelectric device test, PCB / IC test, RF test,  high voltage and high

current measurement etc.

Optional Accessories Chuck quick roll out mechanism
Microscope tilt mechanism (Tilting 30° manually by Lever )
Microscope pneumatic lifting mechanism
Laser repair with cutting,ablation and welding function
Probe clamp
Dark field of microscope / DIC / Normarski test, Light intensity / wavelength test
IC hotspot detection by LC
High voltage and high current measurement
Hot chuck
High/Low temprature chuck
Shielding box
Special adapter
Vibration free table
Gold-plated chuck
Coaxial / Triaxial chuck
Chuck quick move-out and fine adjustment mechanism
Chuck rotation fine adjustment
Light intensity / wavelength testing
RF Testing
Active probe
Low current / Capacitance test
Intergartion of intergral sphere
Fixture for Fibre optic coupler test
Fixture of Package IC test
Fixture of PCB test
Special Custom design
Characteristics
Stable structure, Platen can be quick lifted and fine-tuned, Suitable
for probe card installation and usage
Comfortable large handle, Driver Screws: Zero back lash
Compatible with high magnification metallographic microscope Internal circuit/ electrode/ PAD probe
Suitable in University and Research laboratory LD/LED/PD Light intensity / wavelength testing
Up to 12 inch wafer testing IV/CV Characteristic testing of materials / devices
High precision lead screw drive structure, linear movement

High frequency characteristic test of devices

(up to 300GHz frequency)



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